BOND TECH (HONG KONG) LIMITED (邦得)(香港)有限公司
Founded on Jul 10, 2002, BOND TECH (HONG KONG) LIMITED (邦得)(香港)有限公司 is registered in Hong Kong (CR No: 0805605) that specializes in general business activities.
General Information
- Registered Name
- BOND TECH (HONG KONG) LIMITED 邦得(香港)有限公司
- English name
- BOND TECH (HONG KONG) LIMITED
- Chinese name
- 邦得
- Company Registration Number (CR No.):
- 0805605
- Business Registration Number (BRN):
- 32801480
- Company Type
- Company limited by guarantee
- Company Status
- Dissolved
- Date of Incorporation
- 10 Jul, 2002
Source: Hong Kong Companies Registry
Company Name History
- Company name
- Effective Date
- BOND TECH (HONG KONG) LIMITED 邦得(香港)有限公司
- 2002-07-10
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