Bond Technology Co., Limited (邦德科技有限公司)
As a company limited by guarantee, Bond Technology Co., Limited (邦德科技有限公司) (CR No: ) has been providing general business activities since Sep 30, 2025 from its base at UNIT E01, 10/F,, WONG KING INDUSTRIAL BUILDING,, 2-4 , TAI YAU STREET,, SAN PO KONG, HONG KONG.
General Information
- Registered Name
- Bond Technology Co., Limited 邦德科技有限公司
- English name
- Bond Technology Co., Limited
- Chinese name
- 邦德科技有限公司
- Business Registration Number (BRN):
- 78880517
- Company Type
- Company limited by guarantee
- Company Status
- Live
- Date of Incorporation
- 30 Sep, 2025
- Address
- UNIT E01, 10/F,, WONG KING INDUSTRIAL BUILDING,, 2-4 , TAI YAU STREET,, SAN PO KONG, HONG KONG
Source: Hong Kong Companies Registry
Company Name History
- Company name
- Effective Date
- Bond Technology Co., Limited 邦德科技有限公司
- 2025-09-30
User Contributed Information
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