BOND TECHNOLOGY LIMITED (怡邦科技有限公司)
Founded on Jan 24, 1995, BOND TECHNOLOGY LIMITED (怡邦科技有限公司) is registered in Hong Kong (CR No: 0503753) that specializes in general business activities.
General Information
- Registered Name
- BOND TECHNOLOGY LIMITED 怡邦科技有限公司
- English name
- BOND TECHNOLOGY LIMITED
- Chinese name
- 怡邦科技有限公司
- Company Registration Number (CR No.):
- 0503753
- Business Registration Number (BRN):
- C0503753
- Company Type
- Company limited by guarantee
- Company Status
- Dissolved
- Date of Incorporation
- 24 Jan, 1995
Source: Hong Kong Companies Registry
Company Name History
- Company name
- Effective Date
- BOND TECHNOLOGY LIMITED 怡邦科技有限公司
- 1995-01-24
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