BOND WELL HONG KONG TECHNOLOGY LIMITED (寶華香港科技有限公司)
Founded on Feb 18, 1998, BOND WELL HONG KONG TECHNOLOGY LIMITED (寶華香港科技有限公司) is registered in Hong Kong (CR No: 0636670) that specializes in general business activities.
General Information
- Registered Name
- BOND WELL HONG KONG TECHNOLOGY LIMITED 寶華香港科技有限公司
- English name
- BOND WELL HONG KONG TECHNOLOGY LIMITED
- Chinese name
- 寶華香港科技有限公司
- Company Registration Number (CR No.):
- 0636670
- Business Registration Number (BRN):
- 21531337
- Company Type
- Company limited by guarantee
- Company Status
- Live
- Date of Incorporation
- 18 Feb, 1998
Source: Hong Kong Companies Registry
Company Name History
- Company name
- Effective Date
- BOND WELL HONG KONG TECHNOLOGY LIMITED 寶華香港科技有限公司
- 1998-02-18
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