GOLD BOND ENGINEERING MATERIALS LIMITED (金邦工程物料有限公司)
GOLD BOND ENGINEERING MATERIALS LIMITED (金邦工程物料有限公司) is a company limited by guarantee, registered in Hong Kong under CR No: 1063221. Established on Jul 28, 2006, the company specializes in general business activities.
General Information
- Registered Name
- GOLD BOND ENGINEERING MATERIALS LIMITED 金邦工程物料有限公司
- English name
- GOLD BOND ENGINEERING MATERIALS LIMITED
- Chinese name
- 金邦工程物料有限公司
- Company Registration Number (CR No.):
- 1063221
- Business Registration Number (BRN):
- 37019812
- Company Type
- Company limited by guarantee
- Company Status
- Dissolved
- Date of Incorporation
- 28 Jul, 2006
Source: Hong Kong Companies Registry
Company Name History
- Company name
- Effective Date
- GOLD BOND ENGINEERING MATERIALS LIMITED 金邦工程物料有限公司
- 2006-07-28
User Contributed Information
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