J. Bond Technology Company Limited (佳邦科技有限公司)
J. Bond Technology Company Limited (佳邦科技有限公司) is a company limited by guarantee, registered in Hong Kong under CR No: 0972750. Established on May 25, 2005, the company specializes in general business activities.
General Information
- Registered Name
- J. Bond Technology Company Limited 佳邦科技有限公司
- English name
- J. Bond Technology Company Limited
- Chinese name
- 佳邦科技有限公司
- Company Registration Number (CR No.):
- 0972750
- Business Registration Number (BRN):
- 35669257
- Company Type
- Company limited by guarantee
- Company Status
- Live
- Date of Incorporation
- 25 May, 2005
- Address
- UNIT 11, 13/F, BLOCK A,, M P INDUSTRIAL CENTRE,, 18 KA YIP STREET, CHAI WAN, HONG KONG
Source: Hong Kong Companies Registry
Company Name History
- Company name
- Effective Date
- J. Bond Technology Company Limited 佳邦科技有限公司
- 2005-05-25
User Contributed Information
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